Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.151a162 (2001). 21. ... X. He and R. Fulton, Nonlinear dynamic analysis of a printed wiring board, Journal of Electronic Packaging, 124(2), pp. ... W.Z. Lin, K.H. Lee, S.P. Lim, and P. Lu, A model reduction method for the dynamic analysis of micro- electromechanical systems, International Journal of Nonlinear Sciences andanbsp;...
| Title | : | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| Author | : | Ephraim Suhir, Y.C. Lee, C.P. Wong |
| Publisher | : | Springer Science & Business Media - 2007-05-26 |
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