International Conference on Computer Aided Design and Manufacture of Electronic Components, Circuits, and Systems, 3-6 July 1979, University of Sussex

International Conference on Computer Aided Design and Manufacture of Electronic Components, Circuits, and Systems, 3-6 July 1979, University of Sussex

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In addition, this standard specifies the temperature rises allowed on the printed circuit board due to dissipations under catastrophic fault conditions. ... carrying scan-current in television receivers, as cracks could cause arcing and eventually burning of the printed circuit board. ... during a test and a considerable amount of time is then spent on fault-finding and repair before the next test can be undertaken.


Title:International Conference on Computer Aided Design and Manufacture of Electronic Components, Circuits, and Systems, 3-6 July 1979, University of Sussex
Author: Institution of Electrical Engineers. Electronics and Communications Section
Publisher:Inspec/Iee - 1979
ISBN-13:

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